This session will continue to address the principles of DFA, picking up with guidelines to locate and insert parts onto or into an assembly. It will address guidelines related to interconnections. Then, we will cover methods for joining and fastening such as integral attachment, threaded fasteners, adhesives, etc. Finally, we will address DFM/A guidelines related to fabrication of printed circuits boards and assembly of these boards.

Learning Objectives
During this session, participants will learn how to:
  • Apply guidelines for location of insertion of parts during assembly
  • Consider guidelines for interconnections and connectors
  • Reduce axes of assembly and take advantage of gravity with top-down assembly
  • Identify guidelines for common joining and fastening techniques
  • Apply DFA principles to package design
  • Apply DFM/A principles to printed circuit board fabrication and assembly

Who Should Attend:
This series is recommended for anyone involved in product design, manufacturing engineering, or manufacturing management. 
  • Design engineers
  • Product engineers
  • Manufacturing engineers
  • Mechanical engineers 
  • Process engineers
  • Quality engineers 


Training Session Information
Date Presented:
June 11, 2013 2:00 PM Eastern
Length:
1 hour, 30 minutes
Design for Manufacturability and Assembly (DFM/A): Design for Assembly II
Speaker Information
Kenneth Crow   [ view bio ]
Individual topic purchase: Selected
Society of Manufacturing Engineers
Recertification Credit : 1.00
This session is available as recertification credit for individuals who have earned a SME certification.
Preview
Preview Design for Manufacturability and Assembly (DFM/A): Design for Assembly IIPreview Design for Manufacturability and Assembly (DFM/A): Design for Assembly II
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